发明名称 Method for making a semiconductor device with a high-k gate dielectric and a conductor that facilitates current flow across a P/N junction
摘要 A method for making a semiconductor device is described. That method comprises forming on a substrate a first gate dielectric layer that has a first substantially vertical component, then forming a first metal layer on the first gate dielectric layer. After forming on the substrate a second gate dielectric layer that has a second substantially vertical component, a second metal layer is formed on the second gate dielectric layer. In this method, a conductor is formed that contacts both the first metal layer and the second metal layer.
申请公布号 US7045428(B2) 申请公布日期 2006.05.16
申请号 US20040855635 申请日期 2004.05.26
申请人 INTEL CORPORATION 发明人 BRASK JUSTIN K.;KAVALIEROS JACK;DOCZY MARK L.;METZ MATTHEW V.;SHAH UDAY;BARNS CHRIS E.;DATTA SUMAN;TURKOT, JR. ROBERT B.;CHAU ROBERT S.
分类号 H01L21/8234;H01L21/00;H01L21/326;H01L21/336;H01L21/479;H01L21/768;H01L21/8238;H01L21/84 主分类号 H01L21/8234
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