发明名称 |
Method for fabricating a packaging substrate |
摘要 |
A packaging substrate is fabricated using two plating steps for respectively plating the gold-plating areas defined on two opposite sides of the substrate. Before plating, the gold-plating areas are defined by a layer of solder mask. By doing this, the plated gold layer will not overlap with the solder mask, thereby preventing peeling or reliability problems.
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申请公布号 |
US7045460(B1) |
申请公布日期 |
2006.05.16 |
申请号 |
US20050162801 |
申请日期 |
2005.09.23 |
申请人 |
NAN YA PRINTED CIRCUIT BOARD CORPORATION |
发明人 |
WENG YI-TANG;LIN WEI-HSIN;HO SHING-FUN |
分类号 |
H01L21/44;H01L23/492;H05K3/24;H05K3/28;H05K3/42 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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