发明名称 |
Placement of absorbing material in a semiconductor device |
摘要 |
A semiconductor device includes a hermetically sealed housing having a top member and a bottom member. The bottom member includes a recess. A semiconductor die is enclosed within the housing. Absorbing material is positioned in the recess under the semiconductor die. A porous film is positioned between the semiconductor die and the absorbing material.
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申请公布号 |
US7045885(B1) |
申请公布日期 |
2006.05.16 |
申请号 |
US20040008542 |
申请日期 |
2004.12.09 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
CHEN CHIEN-HUA;CRAID DAVID M.;SCHWINABART TROY D. |
分类号 |
H01L23/02;H01L23/20 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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