摘要 |
An enclosure thermal shield ( 10 ) has a thermally insulated open container ( 12 ), a thermally insulated closure member ( 14 ), a thermally conductive liner ( 16 ) along the container's inner surface and along the inner surface of the closure member ( 14 ) forming a thermal circuit when the closure member ( 14 ) closes the container ( 12 ), and a heat reservoir ( 18 ) in thermal contact with the thermal circuit. The heat reservoir ( 18 ) can be placed within the container ( 12 ) or incorporated into the closure member ( 14 ). If incorporated into the closure member ( 14 ), the heat reservoir ( 18 ) can be placed in direct thermal contact with the thermal circuit or connected to the thermal circuit via a thermal conduit ( 28 ). The thermal shield ( 10 ) can further comprise a layer ( 26 ) of insulating material lining the interior surface of the conductive liner ( 16 ). Heat pipes can also be employed as a part of the thermal circuit.
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