发明名称 |
High density patching system with longframe jacks |
摘要 |
A patching system is disclosed herein. The patching system includes a plurality of front-loaded patching modules positionable within a chassis. Each of the patching modules includes first and second longframe jack assemblies and a switch for changing the circuit configurations of the patching module. The patching modules and the chassis provide increased patching density.
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申请公布号 |
US7044803(B2) |
申请公布日期 |
2006.05.16 |
申请号 |
US20040894866 |
申请日期 |
2004.07.20 |
申请人 |
ADC TELECOMMUNICATIONS, INC. |
发明人 |
BAKER SCOTT K.;MUSOLF BRUCE R.;DEWEY JAMES;PETERS JEFFREY L.;GOOD THOMAS |
分类号 |
H01R24/58 |
主分类号 |
H01R24/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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