APPARATUS AND METHOD FOR FORMING SOLDER ZONE, AND CONTINUOUS PLATING APPARATUS

摘要

PROBLEM TO BE SOLVED: To form a solder region by solder paste, and to improve the reliability in joining, and the mechanical strength and quality of the solder itself. SOLUTION: The solder region formation device where a solder region H is formed on a member S is provided with: a storage part 12 of storing solder paste K; a dispenser 14 provided with a nozzle 16 discharging the solder paste K stored in the storage part 12 toward the member S; a discharge control part 18 of controlling the discharge amount and discharge rate of the solder paste K discharged from the nozzle 16; and a heating part 22 forming the solder region H on the member S by heating and melting the solder paste K discharged from the nozzle 16 in the dispenser 14 controlled by the discharge control part 18 and applied to the prescribed position. COPYRIGHT: (C)2005,JPO&NCIPI