发明名称 Hybrid card interconnect
摘要 According to some embodiments, a hybrid card interconnect is provided. The hybrid card interconnect might include, for example, an enclosure having a rectangular opening at one side and defining a first rectangular cavity within the enclosure to receive a first type of card. The interconnection might further include movable guide members coupled to left and right inner surfaces of the enclosures and defining a second rectangular cavity, within the first cavity, to receive a second type card.
申请公布号 US7044767(B2) 申请公布日期 2006.05.16
申请号 US20040880775 申请日期 2004.06.29
申请人 INTEL CORPORATION 发明人 WONG HONG W.;KWONG WAH YIU
分类号 H01R13/64;G06K7/00;G06K13/08;H01R27/02 主分类号 H01R13/64
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