发明名称 Memory cell and method for forming the same
摘要 A semiconductor memory cell structure having 4F<SUP>2 </SUP>dimensions and method for forming the same. The memory cell is formed on a surface of a substrate and includes an active region formed in the substrate, a semiconductor post formed on the surface of the substrate over the active region and a capacitor is formed on the semiconductor post. A vertical access transistor having a gate structure formed on the semiconductor post is configured to electrically couple the respective memory cell capacitor to the active region when accessed.
申请公布号 US7045844(B2) 申请公布日期 2006.05.16
申请号 US20040964872 申请日期 2004.10.13
申请人 发明人
分类号 H01L27/108;H01L21/336;H01L29/76;H01L29/94;H01L31/119 主分类号 H01L27/108
代理机构 代理人
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