SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND LIQUID CRYSTAL MODULE AND SEMICONDUCTOR MODULE INCLUDING THE SEMICONDUCTOR DEVICE

摘要

Resin-sealing of a semiconductor element is carried out in two processes, by (I) forming a first sealing-resin layer by (i) sealing a connecting region of the semiconductor element and a wiring pattern with a first sealing resin, and (ii) curing the first sealing-resin, and then (II) forming a second sealing-resin layer by (i) providing the semiconductor element with a second sealing resin so that at least an edge portion of the semiconductor element is sealed, and (ii) curing the second sealing-resin. A semiconductor device thus obtained has a two-layer structure of the sealing-resin including (I) the first sealing-resin layer sealing the connecting region of the semiconductor element and the wiring pattern and (II) the second sealing-resin layer being so provided to the semiconductor element that at least an exposed edge portion of the semiconductor element is sealed.