| 发明名称 |
METHOD FOR APPLYING METALLIC CONTACTS TO A SEMICONDUCTOR PHOTODETECTOR |
| 摘要 |
The proposed method for applying metallic contacts to the contact surface of a semiconductor photodetector implies the vacuum deposition of two metallic layers - a layer of titanium and a layer of nickel. Titanium is used as adhesively active material.
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| 申请公布号 |
UA14375(U) |
申请公布日期 |
2006.05.15 |
| 申请号 |
UA20050010696 |
申请日期 |
2005.11.14 |
| 申请人 |
LASHKARIOV INSTITUTE OF SEMICONDUCTOR PHYSICS OF THE NATIONAL ACADEMY OF SCIENCES OF UKRAINE |
发明人 |
MASLOV VOLODYMYR PETROVYCH;KOLOMZAROV YURII VIKTOROVYCH |
| 分类号 |
H01L21/00;H01L25/00;H01L27/15;H01L29/40;H01R9/24;H02N6/00 |
主分类号 |
H01L21/00 |
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