| 发明名称 |
ADHESIVE SHEET AND THE MANUFACTURING METHOD FOR A SEMICONDUCTOR EQUIPMENT |
| 摘要 |
Disclosed herein is a hardenable pressure-sensitive adhesive sheet enabling production of a semiconductor device of high reliability while preventing the occurrence of package cracking and other failures. Also disclosed is a process for producing a semiconductor device using the hardenable pressure-sensitive adhesive sheet. A hardenable pressure-sensitive adhesive sheet of the invention has
€ƒ€ƒ€ƒ a hardenable pressure-sensitive adhesive layer comprising a pressure-sensitive component (A) and an epoxy resin (B), wherein the hardenable pressure-sensitive adhesive layer after thermal curing has a storage modulus of 1.0×10 7 Pa or below at 100°C and 1.0×10 5 Pa or above at 160°C. |
| 申请公布号 |
KR20060043767(A) |
申请公布日期 |
2006.05.15 |
| 申请号 |
KR20050022268 |
申请日期 |
2005.03.17 |
| 申请人 |
LINTEC CORPORATION |
发明人 |
NAOYA SAIKI;OSAMU YAMAZAKI;AKIE HAMASAKI |
| 分类号 |
C09J7/00;H01L21/78;C09J4/02;C09J7/02;C09J133/00;C09J163/00;H01L21/00;H01L21/52;H01L21/68 |
主分类号 |
C09J7/00 |
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