| 摘要 |
A glass powder-containing resin composition comprising (A) 100 parts by weight of a lead-free inorganic glass powder and (B) 30 to 70 parts by weight of a binder resin, and a transfer film obtained from this composition. A dielectric layer having excellent surface smoothness can be formed efficiently, the film forming material layer has excellent flexibility so that its surface is not cracked by bending, and the transfer film has excellent flexibility and can be easily rolled. Since the film forming material layer exhibits suitable adhesion, the handling properties of the transfer film are excellent, and the transferability of the film forming material layer, that is, the thermal adhesion of the film forming material layer to the substrate is excellent. |
