发明名称 WIRE BONDING APPARATUS
摘要 A wire bonding apparatus wherein in a high-voltage power supply, an electric torch is connected to the high-voltage side and a wire is connected to the ground side via a ground line, a high voltage is applied across the wire and the electric torch by the high-voltage power supply, thus causing electrical discharge to form a ball on the tip end of the wire, and in a constant-current circuit a current detection circuit, which detects the discharge current, and a high-voltage control circuit, which controls the high voltage in accordance with the discharge current, are provided; and the current detection circuit detects the current that flows through the ground line and is connected to input the detected current into the high-voltage control circuit, and it is judged that the ground line is broken when there is no output from the current detection circuit during the discharge.
申请公布号 KR20060043250(A) 申请公布日期 2006.05.15
申请号 KR20050016596 申请日期 2005.02.28
申请人 KABUSHIKI KAISHA SHINKAWA 发明人 SASAKURA KAZUMASA
分类号 H01L21/60;B23K20/00;H02H3/00 主分类号 H01L21/60
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