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发明名称
POLISHING COMPOSITIONS FOR CONTROLLING METAL INTERCONNECT REMOVAL RATE IN SEMICONDUCTOR WAFERS
摘要
申请公布号
KR20060043078(A)
申请公布日期
2006.05.15
申请号
KR20050014585
申请日期
2005.02.22
申请人
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
发明人
LAVOIE JR. RAYMOND LEE;QUANCI JOHN;YE QIANQIU
分类号
B24B37/00;H01L21/304;B24B1/00;B44C1/22;C08J5/14;C09K3/14
主分类号
B24B37/00
代理机构
代理人
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地址
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