发明名称 |
METHOD OF MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE, PACKAGE MOLDING JIG, METHOD OF MANUFACTURING PACKAGE MOLDING JIG AND MANUFACTURING APPARATUS FOR PACKAGE MOLDING JIG |
摘要 |
A method of manufacturing an optical semiconductor device includes preparing an optical semiconductor provided on a distal end of a first lead portion of a lead frame and connected electrically with a distal end of a second lead portion of the lead frame, forming thermoplastic resin for preparing a package molding jig having a concave portion corresponding to a contour of a package of the optical semiconductor device, inserting the distal ends of the lead portions into the concave portion of the package molding jig for positioning and fixing, and filling packaging resin in the concave portion of the package molding jig. |
申请公布号 |
KR20060043719(A) |
申请公布日期 |
2006.05.15 |
申请号 |
KR20050022019 |
申请日期 |
2005.03.17 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
ADACHI MASAKI;YAMANAKA MASAHARU;NAGASHIMA FUMIHIDE;NAGAFUCHI TATSUHIKO;ABE TAKAO;HARADA MASAYOSHI;HANSEI HIROFUMI;KOTSUBO HIRONARI |
分类号 |
B29C33/38;B29C33/40;B29C39/10;H01L21/00;H01L21/56;H01L23/02;H01L23/495;H01L33/56;H01L33/62 |
主分类号 |
B29C33/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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