SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, CIRCUIT BOARD, AND ELECTRONIC INSTRUMENT

摘要

A semiconductor chip includes a semiconductor substrate including first and second surfaces and a plurality of side surfaces, the first and second surfaces being parallel to each other and facing in opposite directions, the side surfaces connecting peripheries of the first and second surfaces. At least one of the side surfaces is an inclined surface with respect to the first and second surfaces, and a groove is formed in the inclined surface. The groove extends in a direction which intersects a plane parallel to the first and second surfaces and extends in a direction which intersects a plane which intersects the first and second surfaces at right angles.