WHITE LIGHT EMITTING DIODE PACKAGE AND METHOD OF PRODUCING THE SAME

摘要

A method of manufacturing a white light emitting diode package comprises the steps of mounting a light emitting diode on a package substrate having at least one lead frame, preparing phosphor paste having a viscosity of 500~10,000 cps by mixing phosphor powders and a transparent polymer resin, dispensing liquid droplets of the phosphor paste on an upper surface of the light emitting diode such that the phosphor paste is applied onto the upper surface and side surfaces of the light emitting diode, and curing the phosphor paste applied onto the light emitting diode.