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经营范围
发明名称
CMP Process using the slurry containing abrasive of low concentration
摘要
申请公布号
KR100576479(B1)
申请公布日期
2006.05.10
申请号
KR20030096073
申请日期
2003.12.24
申请人
发明人
分类号
H01L21/304;B24B37/04
主分类号
H01L21/304
代理机构
代理人
主权项
地址
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