摘要 |
1,193,112. Soldering; making wire. GENERAL ELECTRIC CO. 26 June, 1967 [29 Aug., 1966], No. 29391/67. Headings B3A and B3R. [Also in Division H2] Conductor wires for use in printed circuit assemblies are manufactured by passing the wire 10, Fig. 1, from a spool 11, through a straightener 12, an extrusion die 14 which produces grooves 15 in the wire, and a cutter 13. A printed circuit board 20, Fig. 5, has an aperture which is lined with a metallized surface 22, the conductor 10b is inserted in the aperture, and is subjected to a solder wave 24, whereupon the solder flows up grooves 15 to form a fillet on the upper surface of the board 20, in addition to the fillet on the lower portion. In a modification, a metallized portion (27), Fig. 6 (not shown), is formed only on the underside of board (20). Other arrangements of single and multi-layer printed circuit boards, Figs. 7-9 (not shown) are described. |