| 摘要 |
The invention relates to a viscosity reducible radiation curable composition comprising at least one radiation curable component and a filler, wherein the composition has the properties i) a yield stress value of < 1100 Pa, ii) a viscosity (at a shear rate of 1 sec between 1 and 1500 Pa.sec, and iii) a filler settling speed less than 0.3 mm/day.
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