| 摘要 |
A substrate lifting arrangement for use in a plasma processing chamber having a chuck configured for supporting a substrate during processing of said substrate within said plasma processing chamber, said substrate lifting arrangement comprising: at least one substrate engaging element movable between a first position in which said substrate engaging element does not engage said substrate and a second position in which said substrate engaging element engages said substrate and lifts said substrate off said chuck; an actuator coupled to said substrate engaging element, said actuator controlling movement of said substrate engaging element between said first and second positions; and a resistance arrangement coupled to said substrate engaging element, said resistance arrangement limiting a current flowing from said substrate to ground through said resistance arrangement, said current being caused by remaining electrical charge on said substrate when said substrate is lifted off said chuck by said substrate engaging element; €ƒ€ƒ€ƒ
wherein said chuck is an electrostatic chuck;
€ƒ€ƒ€ƒ said substrate engaging element includes a plurality of electrically conductive lifting pins supported by a base, said base being supported on an electrically conductive shaft movable between said first and second positions of said substrate engaging element, said shaft being electrically coupled to said ground; and
€ƒ€ƒ€ƒ said resistance arrangement being electrically connected between the substrate and the electrically conductive shaft, when the substrate engaging element engages the substrate. |
