A substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same

摘要

A substrate (50) includes a base member (51) having a through-hole (52), and a conductive metal filling in the through-hole (52) so as to form a penetrating via (55). The penetrating via (55) contains a conductive core member (58) that is substantially at the central axis of the through-hole (52).