发明名称 IMAGE SENSOR ASSEMBLY AND FABRICATION METHDO THEREOF
摘要 <p>Provided is an image sensor assembly and a method for fabricating the same. The image sensor assembly includes an image sensor and a transparent cover. The image sensor detects an image has an exposed light receiving circuit on its surface. The transparent cover has a support. The support protrudes from the surface of the transparent cover to define a predetermined area on the surface of the transparent cover. The support is bonded to the surface of the image sensor to surround the light receiving circuit. The light receiving circuit is sealed by the transparent cover.</p>
申请公布号 KR20060040317(A) 申请公布日期 2006.05.10
申请号 KR20040089865 申请日期 2004.11.05
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, YONG HWAN;YOON, YOUNG KWON;MUN, GI TAE
分类号 H01L27/146;H01L23/00;H01L23/02;H01L27/14;H01L27/148;H04N5/335;H04N5/374 主分类号 H01L27/146
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