发明名称 CIRCUIT WIRING LAYOUT IN SEMICONDUCTOR MEMORY DEVICE AND LAYOUT METHOD THEREOF
摘要 An improved circuit wiring layout provides smooth circuit wiring in a peripheral circuit region adjacent to a memory cell region of a semiconductor memory device, and eliminates a write-speed limiting factor. Forming a metal (instead of a metal silicided polysilicon) wiring layer to be connected to a gate layer, to transmit an electrical signal to the gates of FET (e.g., MOSFET (Metal Oxide Semiconductor Field Effect Transistor) transistors formed in the peripheral circuit region; the metal wiring layer is formed (e.g., using one metal damascene process), on a layer different from a word line layer formed on the gate layer (e.g., using another metal damascene process), thereby obtaining a layout of a peripheral circuit region having a reduced area and without using a silicide process.
申请公布号 KR20060040788(A) 申请公布日期 2006.05.10
申请号 KR20040089600 申请日期 2004.11.05
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YANG, HYANG JA;LEE, SONG JA
分类号 H01L27/04;H01L27/11 主分类号 H01L27/04
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