Method of electrically and mechanically connecting electronic devices to one another

摘要

A method is provided for electrically and mechanically connecting a first electronic device to a second electronic device. At least one electric contact of the first device is located against an electric terminal of the second device. The electric contact is tacked to the electric terminal by simultaneously applying heat and pressure between the electric contact and the electric terminal. The electric contact is subsequently diffusion-bonded to the electric terminal by applying heat to the electric contact and the electric terminal for a select period of time while a pressure between the electric contact and the electric terminal is reduced relative to the pressure when tacking the electric contact to the electric terminal.