发明名称 |
Multi chip module assembly |
摘要 |
A method of assembling at least a first integrated circuit and a second integrated circuit into a multi chip module. The first integrated circuit is attached and electrically connected to a first substrate to form a first assembly, which is tested to ensure that it functions properly. The second integrated circuit is attached and electrically connected to a second substrate to form a second assembly, which is also tested to ensure that it functions properly. The first assembly is attached and electrically connected to the second assembly to form the multi chip module.
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申请公布号 |
US7041516(B2) |
申请公布日期 |
2006.05.09 |
申请号 |
US20020268361 |
申请日期 |
2002.10.10 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
RAJAGOPALAN SARATHY;DESAI KISHOR;MCCORMICK JOHN P.;ALAGARATNAM MANIAM |
分类号 |
H01L21/50;G01R31/26;H01L21/66;H01L21/98;H01L23/538 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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