| 摘要 |
A modular communication jack with low assembling tolerance includes a circuit board being provided on a front portion with spring contact terminals for contacting with a communication plug, and on a rear portion with Insulation Displace Contact terminals for contacting with wire cores of a communication cable; an insulated inner housing assembled to a top of the circuit board to prevent the circuit board from moving in X-direction and Y-direction, and being formed at a front portion with a cavity for receiving a communication plug; an insulated bottom member assembled to a bottom of the circuit board and fixedly connected to the inner housing to sandwich the circuit board between the inner housing and the bottom member and further prevent the circuit board from moving in Z-direction; and an outer housing enclosing an assembly of the inner housing, the bottom member, and the circuit board therein.
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