发明名称 |
Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems |
摘要 |
Methods and apparatus for controllably dispensing photoresist solutions and other fluids in semiconductor manufacturing equipment from an array of syringe-based fluid dispensers. A multi-syringe fluid dispensing system is provided for photoresist coating within a wafer track coating module. The coating module may contain a spin chuck that is positioned within a catch cup. A robotic dispense arm and gripper assembly may be positioned within the coating module for gripping and positioning a fluid syringe. An array of syringes may be stored on a solution tray within the wafer track coating module for holding a plurality of fluid syringes containing photoresist solutions.
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申请公布号 |
US7041172(B2) |
申请公布日期 |
2006.05.09 |
申请号 |
US20030372028 |
申请日期 |
2003.02.20 |
申请人 |
ASML HOLDING N.V. |
发明人 |
BEM BRANKO;BABIKIAN DIKRAN |
分类号 |
B05C5/02;B05C5/00;H01L21/00 |
主分类号 |
B05C5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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