发明名称 Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems
摘要 Methods and apparatus for controllably dispensing photoresist solutions and other fluids in semiconductor manufacturing equipment from an array of syringe-based fluid dispensers. A multi-syringe fluid dispensing system is provided for photoresist coating within a wafer track coating module. The coating module may contain a spin chuck that is positioned within a catch cup. A robotic dispense arm and gripper assembly may be positioned within the coating module for gripping and positioning a fluid syringe. An array of syringes may be stored on a solution tray within the wafer track coating module for holding a plurality of fluid syringes containing photoresist solutions.
申请公布号 US7041172(B2) 申请公布日期 2006.05.09
申请号 US20030372028 申请日期 2003.02.20
申请人 ASML HOLDING N.V. 发明人 BEM BRANKO;BABIKIAN DIKRAN
分类号 B05C5/02;B05C5/00;H01L21/00 主分类号 B05C5/02
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