发明名称 |
Patternable low dielectric constant materials and their use in ULSI interconnection |
摘要 |
The present invention relates to ultra-large scale integrated (ULSI) interconnect structures, and more particularly to patternable low dielectric constant (low-k) materials suitable for use in ULSI interconnect structures. The patternable low-k dielectrics disclosed herein are functionalized polymers that having one or more acid-sensitive imageable functional groups.
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申请公布号 |
US7041748(B2) |
申请公布日期 |
2006.05.09 |
申请号 |
US20030338945 |
申请日期 |
2003.01.08 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
LIN QINGHUANG;SOORIYAKUMARAN RATNAM |
分类号 |
C08L83/04;G03F7/075;C08G77/04;C08G77/14;C08G77/24;C08K5/00;C08L83/06;C09D183/08;G03F7/004;H01L21/312;H01L21/316;H01L21/3205;H01L21/768;H01L23/522;H01L23/532 |
主分类号 |
C08L83/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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