发明名称 RESISTIVE MEMORY DEVICE WITH PROBE ARRAY AND MANUFACTURING METHOD THE SAME
摘要 <p>Provided are a resistive memory device having a probe array and a method of manufacturing the resistive memory device. The resistive memory device includes a memory part (10) having a bottom electrode (100) and a ferroelectric layer (200) sequentially formed on a first substrate; a probe part (20) having an array of resistive probes (400) arranged on a second substrate (300), with the tips of the resistive probes facing the ferroelectric layer (200) such that they can write and read data on the ferroelectric layer; and a binding layer (500) which grabs and fixes the resistive probes on or above the ferroelectric layer. The method of manufacturing the resistive memory device includes forming a bottom electrode and a ferroelectric layer sequentially on a first substrate; forming an array of resistive probes for writing and reading data on a second substrate; and wafer level bonding the first substrate to the second substrate using a binding layer such that tips of the resistive probes face the surface of the ferroelectric layer.</p>
申请公布号 KR20060039109(A) 申请公布日期 2006.05.08
申请号 KR20040088163 申请日期 2004.11.02
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HONG, SEUNG BUM;JUNG, JU HWAN;KO, HYOUNG SOO;PARK, HONG SIK;MIN, DONG KI;KIM, EUN SIK;PARK, CHUL MIN;KIM, SUNG DONG;BAECK, KYOUNG LOCK
分类号 H01L27/105;H01L27/115 主分类号 H01L27/105
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