APPARATUS FOR HANDLING A WAFER USED IN CHEMICAL AND MECHANICAL POLISHING PROCESS,申请号KR20040088134-传众专利搜索

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发明名称	APPARATUS FOR HANDLING A WAFER USED IN CHEMICAL AND MECHANICAL POLISHING PROCESS
摘要
申请公布号	KR20060039089(A)	申请公布日期	2006.05.08
申请号	KR20040088134	申请日期	2004.11.02
申请人	SAMSUNG ELECTRONICS CO., LTD.	发明人	KWON, SUN DUCK;HONG, JIN SUK;SIN, SUNG KI
分类号	H01L21/304	主分类号	H01L21/304
代理机构		代理人
主权项
地址

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