| 摘要 |
A method for manufacturing heat sink device mainly comprises steps of: positioning a plurality of heat-sinking fins by a holding member after they are arranged and assembled; casting a metallic solution into a die for forming a base; locating lower ends of the heat-sinking fins into the metallic solution; and cooling the metallic solution to form a base which is integrated with the lower ends of the heat-sinking fins. The method can be applied to manufacturing heat sink devices for computers, electronic and machinery devices on which the heat would be accumulated.
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