METHODS AND COMPOSITIONS FOR CHEMICAL MECHANICAL POLISHING SUBSTRATES
摘要
Methods and compositions are provided for planarizing a substrate surface with reduced or minimal defects in surface topography. In one aspect, a method is provided for processing a substrate comprising a dielectric material and polysilicon material disposed thereon, polishing the polysilicon material with a high topography selective polishing composition, and polishing the polysilicon material with a material selective composition.
申请公布号
WO2006047088(A1)
申请公布日期
2006.05.04
申请号
WO2005US36564
申请日期
2005.10.12
申请人
APPLIED MATERIALS, INC.;SIN, GARRETT H.;SU, WINSTON Y.;HUEY, SIDNEY P.