| 摘要 |
A test apparatus and method tests a pad conditioner of a chemical mechanical polishing apparatus. The pad conditioner test apparatus includes a main body having a conditioner mounting section that supports the pad conditioner, a conditioner head raising/lowering system that raises and lowers the head of the pad conditioner while the pad conditioner is supported on the test apparatus, and a discrimination section that detects the ability of the head to be raised/lowered in accordance with a program so that the condition of the head can be determined. The test apparatus can prevent various problems that otherwise would occur if a new pad conditioner were directly installed in the chemical mechanical polishing apparatus.
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