发明名称 |
Liquid-cooled heat radiator kit |
摘要 |
A liquid-cooled heat radiator kit is disclosed to include a heat radiator, which has radiation elements at the top wall and parallel grooves at the bottom wall, two liquid-cooled heat pipes bilaterally arranged in parallel at the bottom side of the heat radiator, each liquid-cooled heat pipes having two close ends and a plurality of enclosed chambers spaced between the two close ends, and a plurality of straight flow-guide pipes respectively fastened to the grooves at the bottom side of the heat radiator and connected between the two liquid-cooled heat pipes to form with the enclosed chambers of the liquid-cooled heat pipes a detoured flow passage for the passing of a cooling fluid in one direction.
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申请公布号 |
US2006090883(A1) |
申请公布日期 |
2006.05.04 |
申请号 |
US20050088868 |
申请日期 |
2005.03.25 |
申请人 |
FORWARD ELECTRONICS CO., LTD. |
发明人 |
HUANG JUNG-FONG;HUANG CHIH-CHIEN |
分类号 |
F28D15/00;F28D15/02;F28F9/02;G06F1/20;H01L23/427;H01L23/467;H05K7/20 |
主分类号 |
F28D15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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