发明名称 METHOD OF WAFER PATTERNING FOR REDUCING EDGE EXCLUSION ZONE
摘要 A method includes steps of: (a) providing a wafer on which a film has been deposited; (b) exposing an annular area in an edge exclusion zone of the wafer to radiation having a wavelength suitable for patterning the film in the annular area; and (c) modulating the radiation while exposing the annular area to form a pattern in the film in the annular area.
申请公布号 US2006094246(A1) 申请公布日期 2006.05.04
申请号 US20040980945 申请日期 2004.11.03
申请人 LSI LOGIC CORPORATION 发明人 WHITEFIELD BRUCE;ABERCROMBIE DAVID
分类号 H01L21/469 主分类号 H01L21/469
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