A lead-free solder, comprising: from around 96.8% to around 99.3% tin; from 0.2% to 3.0% copper; from 0.02% to around 0.12% silicon, and optionally 0,005% to 0,01% P and/or 0,0005%-0.01 Ge.
申请公布号
WO2006045995(A1)
申请公布日期
2006.05.04
申请号
WO2005GB03338
申请日期
2005.08.26
申请人
QUANTUM CHEMICAL TECHNOLOGIES (SINGAPORE) PTE. LTD;SINGAPORE ASAHI CHEMICAL & SOLDER INDUSTRIES PTE LTD.;BEATTIE, ALEX, T., S.;CHEW, KAIHWA;KHO, VINCENT, YAE, SERN
