SUBSTRATE PROCESSING METHOD, EXPOSURE APPARATUS AND METHOD FOR MANUFACTURING DEVICE

摘要

Disclosed is a substrate processing method which comprises an exposure step (S7) wherein an immersion area of a first liquid is formed on a substrate and the substrate is exposed by being irradiated with an exposure light through the first liquid, and an immersion step (S3) wherein the substrate is immersed in a second liquid before the exposure step. By this method, occurrences of problems caused by adhesion marks, which are always involved in immersion exposure, can be reduced.