METHOD FOR PLASMA ENHANCED BONDING AND BONDED STRUCTURES FORMED BY PLASMA ENHANCED BONDING
摘要
An electronic device comprises a substrate (110) comprising a first surface and a second surface, a substrate carrier (105) comprising a first surface and a second surface, and an inorganic material (120) bonding the second surface of the substrate (110) and the second surface of the substrate carrier (105).
申请公布号
WO2006047052(A1)
申请公布日期
2006.05.04
申请号
WO2005US35772
申请日期
2005.10.04
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;CHEN, CHIEN-HUA;SNYDER, BARRY C.;HELLEKSON, RONALD A.
发明人
CHEN, CHIEN-HUA;SNYDER, BARRY C.;HELLEKSON, RONALD A.