MULTICHIP PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

A lower chip (102) is fixed and flip-bonded with a liquid underfill (105) coated on the front side of an interposer (101) as an adhesive. On the front side of the interposer (101), a protruding pad (109) having a height of, for example, approximately 10µm is provided, and is connected with a bonding pad (106) provided on the major side of an upper chip (103) by bonding wire (110). The underfill (105) that protruded at the time of fixing the lower chip (102) to the interposer (101) is stopped by the protruding part of the protruding pad (109). Thus, the protruding part of the underfill (105) is prevented from covering the summit part of the protruding pad (109).