| 发明名称 |
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
| 摘要 |
<p>A semiconductor device is provided with continuously stacked three or more wiring layers without a via layer among them. At least one wiring layer of the wiring layers is provided with both wiring and the via for connecting the wirings positioned on the upper and lower layers.</p> |
| 申请公布号 |
WO2006046487(A1) |
申请公布日期 |
2006.05.04 |
| 申请号 |
WO2005JP19422 |
申请日期 |
2005.10.21 |
| 申请人 |
ROHM CO., LTD.;KAGEYAMA, SATOSHI |
发明人 |
KAGEYAMA, SATOSHI |
| 分类号 |
H01L21/768 |
主分类号 |
H01L21/768 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
