| 摘要 |
An integrated circuit chip is provided, which includes a bond pad structure, a low-k dielectric layer, and active circuits. The bond pad structure includes a conductive bond pad, an M<SUB>top </SUB>solid conductive plate, and an M<SUB>top-1 </SUB>solid conductive plate. The M<SUB>top </SUB>solid conductive plate is located under the bond pad. The M<SUB>top </SUB>plate is electrically coupled to the bond pad. The M<SUB>top-1 </SUB>solid conductive plate is located under the M<SUB>top </SUB>plate. A low-k dielectric layer is located under the bond pad of the bond pad structure. At least part of an active circuit is located under the bond pad of the bond pad structure.
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