Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the same

摘要

A flip chip package generally includes a substrate, a flip chip die, and a heat spreader. The flip chip die is coupled to the substrate. The heat spreader is coupled to the flip chip die. The flip chip package can further include an encapsulate. The encapsulate can protect the flip chip die and/or other components of the flip chip package from the environment. The heat spreader can include one or more recessed edge portions to facilitate injection of the encapsulate into the flip chip package.