发明名称 Nitride semiconductor device and fabrication method thereof
摘要 A nitride semiconductor device is provided that prevents development of cracks, that has nitride semiconductor thin films with uniform thicknesses and good growth surface flatness, and is thus consistent in characteristics, and that can be fabricated at a satisfactory yield. In this nitride semiconductor device, the nitride semiconductor thin films are grown on a substrate having an off-angle between a direction normal to the surface of ridges and the crystal direction <0001>. This helps either reduce or intentionally promote diffusion or movement of the atoms or molecules of a source material of the nitride semiconductor thin films through migration thereof. As a result, a nitride semiconductor growth layer with good surface flatness can be formed, and thus a nitride semiconductor device with satisfactory characteristics can be obtained.
申请公布号 US2006094244(A1) 申请公布日期 2006.05.04
申请号 US20050263036 申请日期 2005.11.01
申请人 YAMADA EIJI;KAMIKAWA TAKESHI;ARAKI MASAHIRO 发明人 YAMADA EIJI;KAMIKAWA TAKESHI;ARAKI MASAHIRO
分类号 H01L21/311 主分类号 H01L21/311
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