| 摘要 |
An embedded multilayer printed circuit includes a first ground plane ( 105, 1205, 1405 ) of a multilayer printed circuit board and an embedded layer. The embedded layer includes a co-planar capacitor ( 110, 1210, 1410 ), a distributed inductor ( 125, 1215, 1415 ), and a capacitive plate ( 135, 1220, 1420 ) circuit. The capacitive plate is a plate of a vertical capacitor ( 270, 1305, 1505 ). The embedded layer further includes a node ( 111, 1225, 1425 ) of the embedded multilayer printed circuit that is formed by a connection of a first terminal of the co-planar capacitor and a first terminal of the first distributed inductor, and in some embodiments, the first capacitive plate is also connected to the node. A second terminal of one of the co-planar capacitor and the distributed inductor is connected to the first ground plane.
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