发明名称 Copper alloy thin films, copper alloy sputtering targets and flat panel displays
摘要 A Cu alloy thin film contains Fe and P with the balance being substantially Cu, in which the contents of Fe and P satisfy all the following conditions (1) to (3), and in which Fe<SUB>2</SUB>P is precipitated at grain boundaries of Cu after heat treatment at 200° C. to 500° C. for 1 to 120 minutes: <?in-line-formulae description="In-line Formulae" end="lead"?>1.4N<SUB>Fe</SUB>+8N<SUB>P</SUB><1.3 (1)<?in-line-formulae description="In-line Formulae" end="tail"?> <?in-line-formulae description="In-line Formulae" end="lead"?>N<SUB>Fe</SUB>+48N<SUB>P</SUB>>1.0 (2)<?in-line-formulae description="In-line Formulae" end="tail"?> <?in-line-formulae description="In-line Formulae" end="lead"?>12N<SUB>Fe</SUB>+N<SUB>P</SUB>>0.5 (3)<?in-line-formulae description="In-line Formulae" end="tail"?> wherein N<SUB>Fe </SUB>represents the content of Fe (atomic percent); and N<SUB>P </SUB>represents the content of P (atomic percent).
申请公布号 US2006091792(A1) 申请公布日期 2006.05.04
申请号 US20050235196 申请日期 2005.09.27
申请人 发明人 KUGIMIYA TOSHIHIRO;TOMIHISA KATSUFUMI;TAKAGI KATSUTOSHI;NAKAI JUNICHI
分类号 H01J1/62;H01J63/04 主分类号 H01J1/62
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