发明名称 Laser processing apparatus and laser processing method
摘要 To process a surface of a substrate by applying a laser beam to the surface, while liquid is being applied to the surface, distance between the surface of the substrate and a reference point on the axis of a laser displacement meter, distance between the surface of the substrate and the lower end an optical unit is adjusted in accordance with distance measured, and a laser beam is then applied to the surface of the substrate.
申请公布号 US2006092990(A1) 申请公布日期 2006.05.04
申请号 US20050258281 申请日期 2005.10.26
申请人 KOGA NORIHISA;KOGA SHINJI;YOSHITAKA NAOTO;NISHIYA AKIRA 发明人 KOGA NORIHISA;KOGA SHINJI;YOSHITAKA NAOTO;NISHIYA AKIRA
分类号 H01S3/30 主分类号 H01S3/30
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