| 摘要 |
There is disclosed a novel sandwich blister package for adhesive composition products and similar articles which generally experience short shelf lives due to exposure to air, vapors, and other environmental elements. The package comprises a plastic film blister having heat-formed cavities which contain the product; and a laminated blister card superimposed upon and sealed to the plastic film blister to form an air, water, and vapor-proof blister package assembly of a predetermined size and shape that significantly extends shelf life of the adhesive composition product.
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