发明名称 EXPOSURE METHOD AND APPARATUS
摘要 When a pattern is formed by exposure in a recording medium such as printed wiring board on which a photosensitive layer such as a resist layer is arranged, removal failure or easy separation of the photosensitive layer is prevented while maintaining adhesion of the photosensitive layer. Specifically, when a wiring pattern is exposed into a resist layer which is arranged on a substrate using an exposure apparatus (3), the irradiation energy of light illuminating the edge region of the wiring pattern is set larger than the irradiation energy of light illuminating regions other than the edge region.
申请公布号 WO2006046764(A1) 申请公布日期 2006.05.04
申请号 WO2005JP20161 申请日期 2005.10.27
申请人 FUJI PHOTO FILM CO., LTD.;SASAKI, YOSHIHARU 发明人 SASAKI, YOSHIHARU
分类号 G03F7/20;G03F1/08;H05K3/00;H05K3/28;H05K3/34 主分类号 G03F7/20
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