薄片上榧制空心铆钉之方法,申请号TW011037-传众专利搜索

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发明名称	薄片上榧制空心铆钉之方法
摘要
申请公布号	TW002957	申请公布日期	1966.09.01
申请号	TW011037	申请日期	1965.10.11
申请人	台湾铝业股份有限公司	发明人	孙景华
分类号	B21K	主分类号	B21K
代理机构		代理人
主权项
地址	高雄巿成功二路15号

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